Pengaruh rapat arus terhadap kualitas pelapisan endapan perak pada lempeng tembaga

Yosipa , Tanty (2004) Pengaruh rapat arus terhadap kualitas pelapisan endapan perak pada lempeng tembaga. Undergraduate thesis, FMIPA UNDIP.

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Abstract

Telah dilakukan penelitian tentang pengaruh rapat arus terhadap kualitas pelapisan endapan perak pada lempeng tembaga. Pengujian dilakukan dengan metode elektroplating, yaitu proses pelapisan logam dengan logam lain secara elektrolitik. Pelapisan perak dilakukan pada rapat arus 0,102; 0,305; 0,508; 0,711; dan 0,915 mA/cm2, dengan mempertahankan konsentrasi AgNO3 dan waktu elektroplating. Dari basil penelitian diketahui bahwa endapan perak bertambah dengan meningkatnya kuat arus, sedangkan berdasarkan uji ketahanan lapisan diperoleh lapisan perak yang paling kuat adalah pada rapat arus 0,915 mA/cm2. Kata kunci: rapat arus, tembaga, perak, elektroplatingThe effect of current density to the quality layer of silver deposition on copper cathode has been examined. Research was done using electroplating method, the process of covering metal with another metal electrolysis. Silver electroplating was done at current density 0.102, 0.305, 0.508, 0311, and 0.915 mA/cm2, by controlled concentration and electroplating time. Result showed that increasing current strength could add the quantity of silver deposit. Deposit strength test showed the best deposit quality gained at 0.915.mAJcm2. Keywords: current density, copper, silver, electroplating

Item Type:Thesis (Undergraduate)
Subjects:Q Science > QD Chemistry
Divisions:Faculty of Science and Mathematics > Department of Chemistry
ID Code:30978
Deposited By:Mr UPT Perpus 1
Deposited On:10 Nov 2011 14:54
Last Modified:10 Nov 2011 14:54

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