Andini Nur , Vania Swari and Arimaz , Hangga and Doty , Dewi Risanti (2012) Simulation of Duplex Heat Treatment Nb3Sn Compounds in Cu-Nb-Sn Superconducting Multifilamentary Wire. In: International Conference on Chemical and Material Engineering 2012. ISBN : 978-602-097-281-7, September 12 – 13, 2012, , Grand Candi Hotel, Semarang Indonesia.
![[img]](/style/images/fileicons/application_pdf.png)
| PDF - Published Version 671Kb |
Abstract
Nb3Sn is intermetallic compounds being used as superconductor formed by diffusion of Sn through grain boundary during internal tin process. It was known that grain boundary diffusion is dominant among any other mechanism. Numerical approached by finite difference method is used to study the distribution concentration of Sn. The present study focused on duplex heat treatment process i.e. it consists of two step heat treatments. Temperature and time of heat treatments were varied between 675-800oC and 32-200 hours, respectively. Duplex heat treatment can increase the Nb3Sn layer thickness, with the optimum increase was obtained as the first heat treatment temperature was set to be lower than that of the second one. The growth of the Nb3Sn at the Nb3Sn-Nb boundary depends largely on the concentration Sn at the grain boundaries.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | T Technology > TP Chemical technology |
| Divisions: | UNDIP Conference/Seminar > International Conference on Chemical and Material Engineering 2012 Faculty of Engineering > Department of Chemical Engineering Faculty of Engineering > Department of Chemical Engineering |
| ID Code: | 36968 |
| Deposited By: | INVALID USER |
| Deposited On: | 16 Nov 2012 22:46 |
| Last Modified: | 16 Nov 2012 22:46 |
Repository Staff Only: item control page
